254C-1x-xxP-1 SIP IC Socket

Material:

Pin (outer sheave} : Brass, machined, {uZnBSPbZ
Clip (contact 4 finger : Beryllium copper heat treated or PHBZ
Plating (outer sleeve} : Tin. plated : 2um/80u" nickel, Sum/200u" Tin
Gold plated: 2um/80u" nickel, full gold
Plating clip (contact): 2um/80u" nickel, gold or Tin plating
Insulator body (black) : Glass filled thermoplastic polyester UL94V-0

Electrical:

Current rating : 3 Amps/contact max.
Contact resistance ≤4mΩ/contact
Insulation resistance ≥1000MΩ at 500V AC
Rated voltage : 100 VRMS/150VDC

Mechanical:

Operating temperature .- Gold plated:-55℃ to +125℃
(Continuous) -67℉ to +105℉
Tin plated:-40℃ to +109℃
Average insertion force with steel pin of: ¢0.43mm/0.017" < 250g
Average withdrawal force with steel pin of $0.43mm/0.017“> 50g
Mechanical life : min.200
Applications and features:
1.The open frame is most common type.
2.The open body design gives better access (for cleaning and inspections) to air-cooling.
3.Side and end stackable.
4.High retention design prevents IC walkout during heavy vibration.
5.Closed bottom sleeve for 100% anti-wicking of solder.
6.Twist free construction.
Environmental data
Solder ability (IEC 60068-2-20. Ta) : 235℃,2s
Resistance to soldering heat (IEC 60068-2-20. Tb) : Through hole mount components : 260℃,10s